The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory ...

During the event, SK hynix showed off some of its AI memory products, including its new HBM3E 12-Hi stack memory which it started mass-producing in September, marking a significant milestone in the ...

The fifth generation of High Bandwidth Memory is currently in use as HBM3E. After SK Hynix delivered samples of the upcoming HBM4 generation with 12 layers of 24 Gbit each back in March, mass ...

As SK hynix leads and Samsung lags, Micron positions itself as a strong contender in the high-bandwidth memory market for generative AI. Micron Technology (Nasdaq:MU) has started shipping samples of ...

High Bandwidth Memory (HBM) is the commonly used type of DRAM for data center GPUs like NVIDIA's H200 and AMD's MI325X. High Bandwidth Flash (HBF) is a stack of flash chips with an HBM interface. What ...

Microsoft announced today a new security feature for the Windows operating system. Named "Hardware-enforced Stack Protection," this feature allows applications to use the local CPU hardware to protect ...

IBM's so-called 3D-chip technology is set to be used in next-generation memory processors from Micron Technology, yielding very-high-speed DRAM. Brooke Crothers writes about mobile computer systems, ...